Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685909 | Power package having multiple mold compounds | Edward Fuergut | 2020-06-16 |
| 10629575 | Stacked die semiconductor package with electrical interposer | Thorsten Scharf, Carsten Ahrens, Helmut Brech, Thorsten Meyer, Matthias Zigldrum | 2020-04-21 |