Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734250 | Method of manufacturing a package having a power semiconductor chip | Thomas Basler, Christian Kasztelan, Ralf Otremba | 2020-08-04 |
| 10685909 | Power package having multiple mold compounds | Martin Gruber | 2020-06-16 |
| 10573533 | Method of reducing a sheet resistance in an electronic device, and an electronic device | Irmgard Escher-Poeppel, Stephanie Fassl, Paul Ganitzer, Gerhard Poeppel, Werner Schustereder +1 more | 2020-02-25 |