Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734250 | Method of manufacturing a package having a power semiconductor chip | Thomas Basler, Edward Fuergut, Ralf Otremba | 2020-08-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734250 | Method of manufacturing a package having a power semiconductor chip | Thomas Basler, Edward Fuergut, Ralf Otremba | 2020-08-04 |