Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763246 | Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material | Klaus Schiess, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2020-09-01 |
| 10755999 | Multi-package top-side-cooling | Uwe Kirchner, Matteo-Alessandro Kutschak, Klaus Schiess, Bernd Schmoelzer | 2020-08-25 |
| 10734250 | Method of manufacturing a package having a power semiconductor chip | Thomas Basler, Edward Fuergut, Christian Kasztelan | 2020-08-04 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Chooi Mei Chong, Markus Dinkel, Josef Hoeglauer, Klaus Schiess, Xaver Schloegel | 2020-06-30 |
| 10698021 | Device including a compound semiconductor chip | Klaus Schiess | 2020-06-30 |
| 10699978 | SMD package with top side cooling | Amirul Afiq Hud, Teck Sim Lee, Xaver Schloegel, Bernd Schmoelzer | 2020-06-30 |
| 10615145 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Werner Reiss | 2020-04-07 |
| 10566260 | SMD package with top side cooling | Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner, Guenther Lohmann +2 more | 2020-02-18 |