Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777536 | Semiconductor package with air cavity | Chau Fatt Chiang, April Coleen Tuazon Bernardez, Junny Abdul Wahid, Roslie Saini bin Bakar, Kon Hoe Chin +8 more | 2020-09-15 |
| 10615145 | Soldering a conductor to an aluminum metallization | Edmund Riedl, Wu Hu Li, Alexander Heinrich, Ralf Otremba | 2020-04-07 |