Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727151 | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package | Liu Chen, Jia Yi Wong, Wei Han Koo, Thomas Stoeck, Gilles Delarozee | 2020-07-28 |
| 10699978 | SMD package with top side cooling | Ralf Otremba, Amirul Afiq Hud, Xaver Schloegel, Bernd Schmoelzer | 2020-06-30 |