Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727151 | Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package | Teck Sim Lee, Jia Yi Wong, Wei Han Koo, Thomas Stoeck, Gilles Delarozee | 2020-07-28 |