Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833583 | Methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2020-11-10 |
| 10699978 | SMD package with top side cooling | Ralf Otremba, Amirul Afiq Hud, Teck Sim Lee, Bernd Schmoelzer | 2020-06-30 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Ralf Otremba, Chooi Mei Chong, Markus Dinkel, Josef Hoeglauer, Klaus Schiess | 2020-06-30 |
| 10700037 | Reinforcement for electrical connectors | Eung San Cho, Thorsten Meyer, Thomas Behrens, Josef Hoeglauer | 2020-06-30 |
| 10601314 | Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski +1 more | 2020-03-24 |
| 10566260 | SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2020-02-18 |