Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833583 | Methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2020-11-10 |
| 10818646 | Power stage device with carrier frame for power stage module and integrated inductor | Eung San Cho | 2020-10-27 |
| 10811342 | Semiconductor package and method of manufacturing a semiconductor package | Sergey Yuferev, Robert Fehler | 2020-10-20 |
| 10765006 | Electronic module | Risto Tuominen | 2020-09-01 |
| 10734351 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Thorsten Scharf, Ralf Wombacher | 2020-08-04 |
| 10692803 | Die embedding | — | 2020-06-23 |
| 10601314 | Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules | Frank Daeche, Zeeshan Umar, Andrew N. Sawle, Maciej Wojnowski, Xaver Schloegel +1 more | 2020-03-24 |