Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734351 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Thorsten Scharf | 2020-08-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10734351 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | Petteri Palm, Thorsten Scharf | 2020-08-04 |