RW

Ralf Wombacher

Infineon Technologies Ag: 1 patents #355 of 900Top 40%
📍 Burglengenfeld, DE: #2 of 11 inventorsTop 20%
Overall (2020): #305,389 of 565,922Top 55%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10734351 Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate Petteri Palm, Thorsten Scharf 2020-08-04