Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804116 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2020-10-13 |
| 10804115 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2020-10-13 |
| 10770444 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Arun Virupaksha Gowda | 2020-09-08 |
| 10765006 | Electronic module | Petteri Palm | 2020-09-01 |
| 10700035 | Stacked electronics package and method of manufacturing thereof | Arun Virupaksha Gowda | 2020-06-30 |
| 10553556 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Arun Virupaksha Gowda | 2020-02-04 |
| 10541153 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2020-01-21 |
| 10541209 | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Kaustubh Ravindra Nagarkar | 2020-01-21 |