Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804116 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Risto Tuominen | 2020-10-13 |
| 10804115 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Risto Tuominen | 2020-10-13 |
| 10692737 | Multilayer interconnect structure with buried conductive via connections and method of manufacturing thereof | Raymond Albert Fillion | 2020-06-23 |
| 10607929 | Electronics package having a self-aligning interconnect assembly and method of making same | Christopher James Kapusta, Arun Virupaksha Gowda, James Wilson Rose | 2020-03-31 |
| 10602950 | Multimodal probe array | Jeffrey Michael Ashe, Christopher Michael Puleo, Christopher Fred Keimel, Craig Patrick Galligan, Yizhen Lin +4 more | 2020-03-31 |
| 10566301 | Semiconductor logic device and system and method of embedded packaging of same | Raymond Albert Fillion | 2020-02-18 |
| 10541153 | Electronics package with integrated interconnect structure and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Risto Tuominen | 2020-01-21 |
| 10541209 | Electronics package including integrated electromagnetic interference shield and method of manufacturing thereof | Christopher James Kapusta, Raymond Albert Fillion, Risto Tuominen | 2020-01-21 |