Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770444 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Risto Tuominen | 2020-09-08 |
| 10700035 | Stacked electronics package and method of manufacturing thereof | Risto Tuominen | 2020-06-30 |
| RE48015 | Interconnect devices for electronic packaging assemblies | Gamal Refai-Ahmed, David Mulford Shaddock, John Anthony Vogel, Christian M. Giovanniello | 2020-05-26 |
| 10607929 | Electronics package having a self-aligning interconnect assembly and method of making same | Christopher James Kapusta, Kaustubh Ravindra Nagarkar, James Wilson Rose | 2020-03-31 |
| 10607957 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Paul Alan McConnelee, Shakti Singh Chauhan | 2020-03-31 |
| 10553556 | Electronics package having a multi-thickness conductor layer and method of manufacturing thereof | Risto Tuominen | 2020-02-04 |