Arun Virupaksha Gowda — 6 Patents at GE

Issued Patents 2020

Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10770444	Electronics package having a multi-thickness conductor layer and method of manufacturing thereof	Risto Tuominen	2020-09-08	$18,040,000
10700035	Stacked electronics package and method of manufacturing thereof	Risto Tuominen	2020-06-30	$13,402,000
RE48015	Interconnect devices for electronic packaging assemblies	Gamal Refai-Ahmed, David Mulford Shaddock, John Anthony Vogel, Christian M. Giovanniello	2020-05-26
10607929	Electronics package having a self-aligning interconnect assembly and method of making same	Christopher James Kapusta, Kaustubh Ravindra Nagarkar, James Wilson Rose	2020-03-31	$9,765,000
10607957	Ultra-thin embedded semiconductor device package and method of manufacturing thereof	Paul Alan McConnelee, Shakti Singh Chauhan	2020-03-31	$9,765,000
10553556	Electronics package having a multi-thickness conductor layer and method of manufacturing thereof	Risto Tuominen	2020-02-04	$28,211,000