Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ultra-thin embedded semiconductor device package and method of manufacturing thereof

Ultra-thin embedded semiconductor device package and method of manufacturing thereof

US Patent 10607957 · Granted Mar 31, 2020

Estimated economic value: $9,765,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power distribution circuits for electrically powered aircraft2025
Electronic connection assembly2025
Power overlay module with thermal storage2025
Semiconductor device package and method of forming2024
Ultra-thin embedded semiconductor device package and method of manufacturing the2023
Ultra-thin embedded semiconductor device package and method of manufacturing the2023
Ultra-thin embedded semiconductor device package and method of manufacturing the2023
Power overlay module and method of assembling2023
Power electronics package and method of manufacturing thereof2021
Power electronics package and method of manufacturing thereof2021
Electronics package having a multi-thickness conductor layer and method of manuf2020
Stacked electronics package and method of manufacturing thereof2020