| 10770364 |
Chip scale package (CSP) including shim die |
Hong Shi, Suresh Ramalingam, Siow Chek Tan |
2020-09-08 |
| 10741998 |
Thermal-mechanical adjustment for laser system |
Sandip Maity, Ying Zhou, David Peter Robinson |
2020-08-11 |
| 10720377 |
Electronic device apparatus with multiple thermally conductive paths for heat dissipation |
Ho Hyung Lee, Hui-Wen Lin, Henley Liu, Suresh Ramalingam |
2020-07-21 |
| RE48015 |
Interconnect devices for electronic packaging assemblies |
David Mulford Shaddock, Arun Virupaksha Gowda, John Anthony Vogel, Christian M. Giovanniello |
2020-05-26 |
| 10629512 |
Integrated circuit die with in-chip heat sink |
Hong-Tsz Pan, Jonathan Chang, Nui Chong, Henley Liu, Suresh Ramalingam |
2020-04-21 |
| 10527670 |
Testing system for lid-less integrated circuit packages |
Ivor G. Barber, Suresh Ramalingam, Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu +2 more |
2020-01-07 |
| 10529645 |
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management |
Jaspreet S. Gandhi, Henley Liu, Tien-Yu Lee, Myongseob Kim, Ferdinand F. Fernandez +2 more |
2020-01-07 |
