Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10527670 | Testing system for lid-less integrated circuit packages | Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Jaspreet S. Gandhi, Henley Liu +2 more | 2020-01-07 |
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Jaspreet S. Gandhi, Henley Liu, Gamal Refai-Ahmed, Myongseob Kim, Ferdinand F. Fernandez +2 more | 2020-01-07 |