| 10770364 |
Chip scale package (CSP) including shim die |
Hong Shi, Siow Chek Tan, Gamal Refai-Ahmed |
2020-09-08 |
| 10720377 |
Electronic device apparatus with multiple thermally conductive paths for heat dissipation |
Gamal Refai-Ahmed, Ho Hyung Lee, Hui-Wen Lin, Henley Liu |
2020-07-21 |
| 10629512 |
Integrated circuit die with in-chip heat sink |
Hong-Tsz Pan, Jonathan Chang, Nui Chong, Henley Liu, Gamal Refai-Ahmed |
2020-04-21 |
| 10593638 |
Methods of interconnect for high density 2.5D and 3D integration |
Jaspreet S. Gandhi, Henley Liu |
2020-03-17 |
| 10527670 |
Testing system for lid-less integrated circuit packages |
Gamal Refai-Ahmed, Ivor G. Barber, Jaspreet S. Gandhi, Tien-Yu Lee, Henley Liu +2 more |
2020-01-07 |
| 10529645 |
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management |
Jaspreet S. Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim +2 more |
2020-01-07 |