HL

Hui-Wen Lin

AM AMD: 1 patents #346 of 1,004Top 35%
TSMC: 1 patents #1,818 of 3,471Top 55%
📍 Jianshi, CA: #1 of 2 inventorsTop 50%
Overall (2020): #166,645 of 565,922Top 30%
2
Patents 2020

Issued Patents 2020

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10720377 Electronic device apparatus with multiple thermally conductive paths for heat dissipation Gamal Refai-Ahmed, Ho Hyung Lee, Henley Liu, Suresh Ramalingam 2020-07-21
10553699 Gate structure of a semiconductor device Ming Zhu, Harry-Hak-Lay Chuang, Bao-Ru Young, Yuan-Sheng Huang, Ryan Chia-Jen Chen +4 more 2020-02-04