| 10770430 |
Package integration for memory devices |
Myongseob Kim, Cheang-Whang Chang, Jaspreet S. Gandhi |
2020-09-08 |
| 10720377 |
Electronic device apparatus with multiple thermally conductive paths for heat dissipation |
Gamal Refai-Ahmed, Ho Hyung Lee, Hui-Wen Lin, Suresh Ramalingam |
2020-07-21 |
| 10692837 |
Chip package assembly with modular core dice |
Myongseob Kim, Cheang-Whang Chang, Nui Chong |
2020-06-23 |
| 10629512 |
Integrated circuit die with in-chip heat sink |
Hong-Tsz Pan, Jonathan Chang, Nui Chong, Gamal Refai-Ahmed, Suresh Ramalingam |
2020-04-21 |
| 10593638 |
Methods of interconnect for high density 2.5D and 3D integration |
Jaspreet S. Gandhi, Suresh Ramalingam |
2020-03-17 |
| 10527670 |
Testing system for lid-less integrated circuit packages |
Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Jaspreet S. Gandhi, Tien-Yu Lee +2 more |
2020-01-07 |
| 10529645 |
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management |
Jaspreet S. Gandhi, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim, Ferdinand F. Fernandez +2 more |
2020-01-07 |