Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770430 | Package integration for memory devices | Myongseob Kim, Henley Liu, Jaspreet S. Gandhi | 2020-09-08 |
| 10692837 | Chip package assembly with modular core dice | Myongseob Kim, Henley Liu, Nui Chong | 2020-06-23 |