Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756711 | Integrated circuit skew determination | Amitava Majumdar | 2020-08-25 |
| 10692837 | Chip package assembly with modular core dice | Myongseob Kim, Henley Liu, Cheang-Whang Chang | 2020-06-23 |
| 10629512 | Integrated circuit die with in-chip heat sink | Hong-Tsz Pan, Jonathan Chang, Henley Liu, Gamal Refai-Ahmed, Suresh Ramalingam | 2020-04-21 |
| 10566050 | Selectively disconnecting a memory cell from a power supply | Shidong Zhou, Jing Jing Chen | 2020-02-18 |