Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770430 | Package integration for memory devices | Henley Liu, Cheang-Whang Chang, Jaspreet S. Gandhi | 2020-09-08 |
| 10692837 | Chip package assembly with modular core dice | Henley Liu, Cheang-Whang Chang, Nui Chong | 2020-06-23 |
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Jaspreet S. Gandhi, Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Ferdinand F. Fernandez +2 more | 2020-01-07 |