Issued Patents 2020
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879157 | High density substrate and stacked silicon package assembly having the same | — | 2020-12-29 |
| 10861825 | Interconnect structures with intermetallic palladium joints and associated systems and methods | — | 2020-12-08 |
| 10847382 | Solder bond site including an opening with discontinuous profile | Dale Arnold | 2020-11-24 |
| 10770430 | Package integration for memory devices | Myongseob Kim, Henley Liu, Cheang-Whang Chang | 2020-09-08 |
| 10748878 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, James M. Derderian | 2020-08-18 |
| 10741460 | Methods for forming interconnect assemblies with probed bond pads | Owen R. Fay, Kyle K. Kirby, Luke England | 2020-08-11 |
| 10741468 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2020-08-11 |
| 10692733 | Uniform back side exposure of through-silicon vias | Wayne H. Huang | 2020-06-23 |
| 10651155 | Thermal pads between stacked semiconductor dies and associated systems and methods | Michel Koopmans | 2020-05-12 |
| 10593638 | Methods of interconnect for high density 2.5D and 3D integration | Suresh Ramalingam, Henley Liu | 2020-03-17 |
| 10580746 | Bonding pads with thermal pathways | James M. Derderian, Sameer S. Vadhavkar, Jian Li | 2020-03-03 |
| 10573612 | Bonding pads with thermal pathways | James M. Derderian, Sameer S. Vadhavkar, Jian Li | 2020-02-25 |
| 10559551 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, James M. Derderian | 2020-02-11 |
| 10527670 | Testing system for lid-less integrated circuit packages | Gamal Refai-Ahmed, Ivor G. Barber, Suresh Ramalingam, Tien-Yu Lee, Henley Liu +2 more | 2020-01-07 |
| 10529645 | Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management | Henley Liu, Tien-Yu Lee, Gamal Refai-Ahmed, Myongseob Kim, Ferdinand F. Fernandez +2 more | 2020-01-07 |