Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763186 | Package cooling by coil cavity | Andrew M. Bayless, Owen R. Fay | 2020-09-01 |
| 10692733 | Uniform back side exposure of through-silicon vias | Jaspreet S. Gandhi | 2020-06-23 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763186 | Package cooling by coil cavity | Andrew M. Bayless, Owen R. Fay | 2020-09-01 |
| 10692733 | Uniform back side exposure of through-silicon vias | Jaspreet S. Gandhi | 2020-06-23 |