Issued Patents 2020
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872835 | Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same | Chan H. Yoo | 2020-12-22 |
| 10847479 | Antenna formation by integrated metal layer or redistribution layer | — | 2020-11-24 |
| 10840229 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Chan H. Yoo | 2020-11-17 |
| 10790251 | Methods for enhancing adhesion of three-dimensional structures to substrates | Christopher J. Gambee, Nhi Doan, Chandra S. Tiwari, Ying Chen | 2020-09-29 |
| 10784224 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Kyle K. Kirby, Sameer S. Vadhavkar | 2020-09-22 |
| 10770398 | Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer | Chan H. Yoo | 2020-09-08 |
| 10763186 | Package cooling by coil cavity | Andrew M. Bayless, Wayne H. Huang | 2020-09-01 |
| 10741460 | Methods for forming interconnect assemblies with probed bond pads | Kyle K. Kirby, Luke England, Jaspreet S. Gandhi | 2020-08-11 |
| 10600750 | Interconnect structures for preventing solder bridging, and associated systems and methods | Kyle S. Mayer | 2020-03-24 |
| 10580720 | Silicon interposer with fuse-selectable routing array | Bret K. Street, Eiichi Nakano | 2020-03-03 |
| 10566686 | Stacked memory package incorporating millimeter wave antenna in die stack | John F. Kaeding | 2020-02-18 |
| 10529592 | Semiconductor device assembly with pillar array | Akshay N. Singh, Kyle K. Kirby | 2020-01-07 |