Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811313 | Methods of fabricating conductive traces and resulting structures | — | 2020-10-20 |
| 10790251 | Methods for enhancing adhesion of three-dimensional structures to substrates | Nhi Doan, Chandra S. Tiwari, Owen R. Fay, Ying Chen | 2020-09-29 |
| 10748857 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Jonathan S. Hacker, Shijian Luo | 2020-08-18 |