Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861797 | Electrically or temperature activated shape-memory materials for warpage control | — | 2020-12-08 |
| 10840209 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2020-11-17 |
| 10840210 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Benjamin L. McClain, Mark E. Tuttle | 2020-11-17 |
| 10748857 | Die features for self-alignment during die bonding | Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker, Shijian Luo | 2020-08-18 |
| 10741528 | Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods | Wei Zhou | 2020-08-11 |
| 10615150 | Semiconductor device with a layered protection mechanism and associated systems, devices, and methods | Wei Zhou | 2020-04-07 |
| 10580710 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Mark E. Tuttle | 2020-03-03 |
| 10580720 | Silicon interposer with fuse-selectable routing array | Owen R. Fay, Eiichi Nakano | 2020-03-03 |