Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10852344 | Inductive testing probe apparatus for testing semiconductor die and related systems and methods | Tony M. Lindenberg, Kurt J. Bossart, Chandra S. Tiwari | 2020-12-01 | $14,926,000 |
| 10847486 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2020-11-24 | $15,546,000 |
| 10763131 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Shijian Luo | 2020-09-01 | $15,473,000 |
| 10748857 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Christopher J. Gambee, Shijian Luo | 2020-08-18 | $12,880,000 |
| 10622223 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Shijian Luo | 2020-04-14 | $17,667,000 |