Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763131 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Jonathan S. Hacker | 2020-09-01 |
| 10748857 | Die features for self-alignment during die bonding | Bret K. Street, Wei Zhou, Christopher J. Gambee, Jonathan S. Hacker | 2020-08-18 |
| 10741468 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2020-08-11 |
| 10679921 | Semiconductor device packages with direct electrical connections and related methods | Steven K. Groothuis, Jian Li | 2020-06-09 |
| 10622223 | Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methods | Jonathan S. Hacker | 2020-04-14 |