Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10816275 | Semiconductor device assembly with vapor chamber | Jian Li | 2020-10-27 |
| 10741468 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li, Shijian Luo +3 more | 2020-08-11 |
| 10679921 | Semiconductor device packages with direct electrical connections and related methods | Jian Li, Shijian Luo | 2020-06-09 |
| 10551129 | Semiconductor device assembly with vapor chamber | Jian Li | 2020-02-04 |