Issued Patents 2020
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840210 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2020-11-17 |
| 10840209 | Methods and systems for manufacturing semiconductor devices | Wei Zhou, Bret K. Street, Benjamin L. McClain | 2020-11-17 |
| 10834853 | Electronic device with a card-level thermal regulator mechanism and associated systems, devices, and methods | — | 2020-11-10 |
| 10712382 | Semiconductor device structures for burn-in testing and methods thereof | — | 2020-07-14 |
| 10714456 | Dual sided fan-out package having low warpage across all temperatures | Chan H. Yoo | 2020-07-14 |
| 10692793 | Electronic device with a package-level thermal regulator mechanism and associated systems, devices, and methods | — | 2020-06-23 |
| 10593568 | Thrumold post package with reverse build up hybrid additive structure | Chan H. Yoo, John F. Kaeding, Ashok Pachamuthu | 2020-03-17 |
| 10580710 | Semiconductor device with a protection mechanism and associated systems, devices, and methods | Wei Zhou, Bret K. Street | 2020-03-03 |
| 10529659 | Semiconductor devices having electrically and optically conductive vias, and associated systems and methods | Eiichi Nakano | 2020-01-07 |