Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593568 | Thrumold post package with reverse build up hybrid additive structure | Chan H. Yoo, Ashok Pachamuthu, Mark E. Tuttle | 2020-03-17 |
| 10586780 | Semiconductor device modules including a die electrically connected to posts and related methods | Ashok Pachamuthu, Chan H. Yoo, Szu-Ying Ho | 2020-03-10 |
| 10566686 | Stacked memory package incorporating millimeter wave antenna in die stack | Owen R. Fay | 2020-02-18 |