Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593568 | Thrumold post package with reverse build up hybrid additive structure | Chan H. Yoo, John F. Kaeding, Mark E. Tuttle | 2020-03-17 |
| 10586780 | Semiconductor device modules including a die electrically connected to posts and related methods | Chan H. Yoo, Szu-Ying Ho, John F. Kaeding | 2020-03-10 |