Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861765 | Carrier removal by use of multilayer foil | James M. Derderian, Xiao Li | 2020-12-08 |
| 10770421 | Bond chucks having individually-controllable regions, and associated systems and methods | Cassie L. Bayless | 2020-09-08 |
| 10770422 | Bond chucks having individually-controllable regions, and associated systems and methods | Cassie L. Bayless | 2020-09-08 |
| 10763186 | Package cooling by coil cavity | Wayne H. Huang, Owen R. Fay | 2020-09-01 |
| 10749071 | Apparatus for processing device structures | — | 2020-08-18 |
| 10679967 | Systems enabling lower-stress processing of semiconductor device structures and related structures | Joseph Brand | 2020-06-09 |
| 10559495 | Methods for processing semiconductor dice and fabricating assemblies incorporating same | James M. Derderian, Xiao Li | 2020-02-11 |