Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861765 | Carrier removal by use of multilayer foil | Andrew M. Bayless, Xiao Li | 2020-12-08 |
| 10748878 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, Jaspreet S. Gandhi | 2020-08-18 |
| 10580746 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2020-03-03 |
| 10573612 | Bonding pads with thermal pathways | Jaspreet S. Gandhi, Sameer S. Vadhavkar, Jian Li | 2020-02-25 |
| 10559495 | Methods for processing semiconductor dice and fabricating assemblies incorporating same | Andrew M. Bayless, Xiao Li | 2020-02-11 |
| 10559551 | Semiconductor device assembly with heat transfer structure formed from semiconductor material | Sameer S. Vadhavkar, Jaspreet S. Gandhi | 2020-02-11 |