Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10667429 | Integrated heat exchange assembly and an associated method thereof | Hendrik Pieter Jacobus de Bock, Graham Charles Kirk, Stanton Earl Weaver, David S. Slaton, Tao Deng +1 more | 2020-05-26 |
| 10631410 | Stacked printed circuit board packages | Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Flynn Carson +9 more | 2020-04-21 |
| 10607957 | Ultra-thin embedded semiconductor device package and method of manufacturing thereof | Arun Virupaksha Gowda, Paul Alan McConnelee | 2020-03-31 |
| 10535611 | Substrate-less integrated components | Flynn Carson, Jun Chung Hsu, Meng Chi Lee | 2020-01-14 |