Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10643952 | Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die | Reza A. Pagaila, Seung Uk Yoon | 2020-05-05 | |
| 10631410 | Stacked printed circuit board packages | Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Shakti Singh Chauhan +9 more | 2020-04-21 | $110,357,000 |
| 10535611 | Substrate-less integrated components | Jun Chung Hsu, Meng Chi Lee, Shakti Singh Chauhan | 2020-01-14 | $151,925,000 |