Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE48111 | Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect | Seng Guan Chow, Seung Uk Yoon, Byung Tai Do, Linda Pei Ee Chua | 2020-07-21 |
| 10643952 | Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die | Flynn Carson, Seung Uk Yoon | 2020-05-05 |