Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813229 | Electronic module having an electrically insulating structure with material having a low modulus of elasticity | Toni Salminen | 2020-10-20 |
| 10796986 | Leadframe leads having fully plated end faces | Stefan Macheiner | 2020-10-06 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Ralf Otremba, Chooi Mei Chong, Josef Hoeglauer, Klaus Schiess, Xaver Schloegel | 2020-06-30 |
| 10566260 | SMD package with top side cooling | Ralf Otremba, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner, Guenther Lohmann +2 more | 2020-02-18 |