Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10796986 | Leadframe leads having fully plated end faces | Markus Dinkel | 2020-10-06 |
| 10770399 | Semiconductor package having a filled conductive cavity | Chee Yang Ng, Hock Siang Chua, Josef Maerz, Nurfarena Othman, Joseph Victor Soosai Prakasam +1 more | 2020-09-08 |