Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10770399 | Semiconductor package having a filled conductive cavity | Hock Siang Chua, Stefan Macheiner, Josef Maerz, Nurfarena Othman, Joseph Victor Soosai Prakasam +1 more | 2020-09-08 |
| 10549985 | Semiconductor package with a through port for sensor applications | Dominic Maier, Matthias Steiert, Chau Fatt Chiang, Christian Geissler, Bernd Goller +5 more | 2020-02-04 |