Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763246 | Device including a semiconductor chip monolithically integrated with a driver circuit in a semiconductor material | Ralf Otremba, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2020-09-01 |
| 10755999 | Multi-package top-side-cooling | Ralf Otremba, Uwe Kirchner, Matteo-Alessandro Kutschak, Bernd Schmoelzer | 2020-08-25 |
| 10698021 | Device including a compound semiconductor chip | Ralf Otremba | 2020-06-30 |
| 10699987 | SMD package with flat contacts to prevent bottleneck | Ralf Otremba, Chooi Mei Chong, Markus Dinkel, Josef Hoeglauer, Xaver Schloegel | 2020-06-30 |
| 10566260 | SMD package with top side cooling | Ralf Otremba, Markus Dinkel, Ulrich Froehler, Josef Hoeglauer, Uwe Kirchner +2 more | 2020-02-18 |