Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867959 | Integrated circuit packaging method and integrated packaged circuit | Junjun Liu, Yuejin Guo, Edward R. Prack | 2020-12-15 |
| 10867961 | Single layer low cost wafer level packaging for SFF SiP | Vijay K. Nair | 2020-12-15 |
| 10847496 | Chip wiring method and structure | Junjun Liu | 2020-11-24 |
| 10615151 | Integrated circuit multichip stacked packaging structure and method | Junjun Liu, Yuejin Guo, Edward R. Prack | 2020-04-07 |
| 10535634 | Multi-layer package | Vijay K. Nair, Thorsten Meyer | 2020-01-14 |