Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10867959 | Integrated circuit packaging method and integrated packaged circuit | Chuan Hu, Junjun Liu, Yuejin Guo | 2020-12-15 |
| 10615151 | Integrated circuit multichip stacked packaging structure and method | Chuan Hu, Junjun Liu, Yuejin Guo | 2020-04-07 |
| 10573622 | Methods of forming joint structures for surface mount packages | Lilia May | 2020-02-25 |