Issued Patents 2020
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879259 | Methods and apparatuses having memory cells including a monolithic semiconductor channel | Jie Sun, Roger W. Lindsay, Brian Cleereman, John D. Hopkins, Hongbin Zhu +3 more | 2020-12-29 |
| 10868031 | Multiple-stack three-dimensional memory device and fabrication method thereof | Jun Liu, Zongliang Huo, Li Xiao, Qian Tao, Yushi Hu +4 more | 2020-12-15 |
| 10867678 | Three-dimensional memory devices | Jun Chen, Jifeng Zhu, Yushi Hu, Jin Wen Dong, Lan Yao | 2020-12-15 |
| 10861862 | Ferroelectric memory devices | — | 2020-12-08 |
| 10860666 | Method and system for providing alternative result for an online search previously with no result | Rongkai Zhao, Kenneth Katschke | 2020-12-08 |
| 10847528 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Jun Chen, Qian Tao, Yushi Hu, Jifeng Zhu +4 more | 2020-11-24 |
| 10833099 | Apparatuses and methods for forming multiple decks of memory cells | Roger W. Lindsay, Akira Goda, John D. Hopkins | 2020-11-10 |
| 10804287 | Three-dimensional memory devices and fabricating methods thereof | Yu Ru Huang, Qian Tao, Yushi Hu, Jun Chen, Xiaowang Dai +3 more | 2020-10-13 |
| 10804279 | Source structure of three-dimensional memory device and method for forming the same | Yushi Hu, Qian Tao, Jun Chen, Simon Shi-Ning Yang, Steve Weiyi Yang | 2020-10-13 |
| 10796993 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Si Ping Hu | 2020-10-06 |
| 10763099 | Wafer flatness control using backside compensation structure | Xiaowang Dai, Qian Tao, Yushi Hu, Ji Xia, Zhaosong Li +1 more | 2020-09-01 |
| 10679941 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Si Ping Hu | 2020-06-09 |
| 10679721 | Structure and method for testing three-dimensional memory device | Jong-jun Kim, Feng Pan, Jong Seuk Lee, Yongna Li, Lidong Song +3 more | 2020-06-09 |
| 10680003 | Staircase structure for memory device | Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao, Yu Ru Huang +6 more | 2020-06-09 |
| 10672711 | Word line contact structure for three-dimensional memory devices and fabrication methods thereof | Jifeng Zhu, Jun Chen, Si Ping Hu, Xiaowang Dai, Lan Yao +4 more | 2020-06-02 |
| 10658379 | Array common source structures of three-dimensional memory devices and fabricating methods thereof | Li Xiao, Qian Tao, Lan Yao | 2020-05-19 |
| 10658378 | Through array contact (TAC) for three-dimensional memory devices | Qian Tao, Yushi Hu, Li Xiao, Xiaowang Dai, Yu Ting Zhou +8 more | 2020-05-19 |
| 10651315 | Three dimensional memory | Hongbin Zhu, Gordon A. Haller, Roger W. Lindsay, Andrew Bicksler, Brian Cleereman +1 more | 2020-05-12 |
| 10651087 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Si Ping Hu | 2020-05-12 |
| 10644015 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Jun Chen, Qian Tao, Yushi Hu, Jifeng Zhu +4 more | 2020-05-05 |
| 10608004 | Semiconductor devices and methods of fabrication | Hongbin Zhu, Gordon A. Haller, Jie Sun, Randy J. Koval, John D. Hopkins | 2020-03-31 |
| 10607887 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Si Ping Hu | 2020-03-31 |
| 10600468 | Methods for operating ferroelectric memory cells each having multiple capacitors | Feng Pan | 2020-03-24 |
| 10593690 | Hybrid bonding contact structure of three-dimensional memory device | Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen, Guanping Wu +2 more | 2020-03-17 |
| 10580788 | Methods for forming three-dimensional memory devices | Jifeng Zhu, Jun Chen, Qian Tao, Si Ping Hu, Jia Wen Wang +1 more | 2020-03-03 |