Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2020-08-18 |
| 10679854 | Wafer bonding method and structure thereof | Shuai Guo, Tao Ding, Rui Xing, Xiao Jin Wang, Jia Wang +1 more | 2020-06-09 |
| 10580788 | Methods for forming three-dimensional memory devices | Jifeng Zhu, Jun Chen, Zhenyu Lu, Qian Tao, Si Ping Hu +1 more | 2020-03-03 |