Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790260 | Plasma activation treatment for wafer bonding | Mengyong Liu, Tao Ding, Wu Liu, Guoliang Chen | 2020-09-29 |
| 10679854 | Wafer bonding method and structure thereof | Shuai Guo, Jia Wen Wang, Tao Ding, Xiao Jin Wang, Jia Wang +1 more | 2020-06-09 |
| 10583111 | Method for preventing or treating diseases associated with the inhibition of EGFR | Shiyi Zhang, Zhaoyu Wu, Chao Liu, Leying Chen, Xin Zhao +3 more | 2020-03-10 |