Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679854 | Wafer bonding method and structure thereof | Jia Wen Wang, Tao Ding, Rui Xing, Xiao Jin Wang, Jia Wang +1 more | 2020-06-09 |
| D885367 | Intelligent speaker | Jing Gu | 2020-05-26 |
| D882548 | Intelligent speaker | Jing Gu | 2020-04-28 |
| 10553565 | Methods and systems for adjusting wafer deformation during wafer bonding | — | 2020-02-04 |
| 10529694 | Methods and systems for wafer bonding alignment compensation | — | 2020-01-07 |