Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872327 | Mobile payment systems and mobile payment methods thereof | Yanshun Guo | 2020-12-22 |
| 10679854 | Wafer bonding method and structure thereof | Shuai Guo, Jia Wen Wang, Tao Ding, Rui Xing, Xiao Jin Wang +1 more | 2020-06-09 |