Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2020-08-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2020-08-18 |